TDK-EPC, a group company of
TDK Corporation, has
launched the new TFSB series
of TDK thin-film band pass filters,
which with a footprint of 1.0 x 0.5
sqmm and an insertion height of just
0.3 mm are the world's smallest, a
release from TDK said. Thanks to the
innovative terminal configuration on
their bottom surface the footprint of
the low-profile 1005 components is
about 50 per cent less than for
conventional filters. The new filters
are designed for the 2.4GHz and
5GHz bands, making them suitable
for Bluetooth and WLAN
applications in smartphones and
other mobile phones.
The new filters achieve low-loss
signal transmission and high
attenuation of unwanted signals,
resulting in a high signal quality.
The band pass filters were developed
by using a thin-film micro-wiring
technology that TDK developed for
the manufacturing of magnetic
heads for hard disk drives. This
technology enables the successful
combination of outstanding
performance characteristics with
small dimensions and a low-profile
form factor, making the product
ideal for RF modules designed for
smart phones and other advanced
mobile phones. The operating
temperature range of the product is -
40 to +85 ÂșC.
TDK-EPC is continually expanding
its portfolio of RF components based
on TDK's innovative thin-film
technology. In addition to the new
band pass filters, this product family
also includes capacitors, baluns,
couplers and diplexers.